Product Information
POLYPAS® polishing pads are designed for ultra-high precision polishing of silicon wafers and all types of semiconductor materials, metal, glasses, etc.
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Ultra-High Precision Polishing PadsPOLYPAS (FP series)
This is a non-woven fabric type polishing pad developed for stock removal (first polishing) of silicon wafers, semiconductor materials, optical lenses, metal, etc.
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Ultra-High Precision Polishing PadsPOLYPAS (FX series)
This is a polishing pad with built-in filler developed for polishing glass substrates for LCDs, glass disks, optical lenses, etc.
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Ultra-High Precision Polishing PadsPOLYPAS (FXA series)
This is a non-filler type hard urethane pad that can be used for various purposes, including first polishing of semiconductor wafers and polishing of crystal oscillator optical lenses.
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Ultra-High Precision Polishing PadsPOLYPAS (Suede series)
The Suede series is a polishing pad for final polishing of semiconductor wafers and hard disks, etc.
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Ultra-High Precision Polishing PadsPOLYPAS (Back Pad series)
This product was developed to retain semiconductor wafers and LCD glass substrates without wax.
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Functional MaterialFunctional film
The product is our original 100% polyurethane sheet and is available for 150 - 1100μm in thickness. The unique porous structure absorbs light and achieves low reflectance (1.1% on average).
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Functional MaterialFunctional non-woven fabric
This is a non-woven fabric sheet with polyester fiber. It is made with functional resin-impregnated and fiber-confounded felt.
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Functional MaterialNew by Core
This is a sheet with an elastomer impregnated non-woven polyester fabric. Due to its excellent processability, higher self-support property, and impact resilience, it is highly regarded as the core material for name brand leather products such as bags and wallets.