POLYPAS (Suede series)
The Suede series is a polishing pad for final polishing of semiconductor wafers and hard disks, etc. In recent years, the requirements for high precision and flatness of the finished surface of any workpiece have become more stringent, and the importance of the flatness and uniformity of the polishing pad itself has become increasingly important. Under such circumstances, the Suede series offers a variety of products for different purposes to respond to various demands and satisfy the needs of our customers.
(01)
Applications
- For first and final polishing of silicon and compound semiconductor wafers
- For polishing metal disks such as aluminum and nickel
- For polishing glass substrates for LCDs, photomasks and hard disks
- For polishing optical lenses and various optical glass parts
- For semiconductor devices
- For polishing other materials, including plastic lenses, stainless and copper plates
(02)
Characteristics
- Scratch-free
- Chemical-resistant and abrasion-resistant
- For the physical properties and characteristics of various products, please contact us.
(03)
Secondary processing and shipping conditions
- All POLYPAS series can be delivered with double-sided adhesive on the back of polishing pads.
- Several kinds of patterning and grooving, such as emboss processing, groove processing and slurry hole processing can be performed on the pad upon request.
- POLYPAS pads can be shipped in any of the specified sizes and shapes, including round, square, and donut shapes, upon request.
Contact
Fujibo Ehime Co., Ltd.,
Tokyo Office
1-18-12, Ningyocho, Nihonbashi,
Chuo-ku, Tokyo 103-0013, Japan
TEL : +81-3-3665-7751
FAX : +81-3-3667-1326
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