POLYPAS (FP series)
This is a non-woven fabric type polishing pad developed for stock removal (first polishing) of silicon wafers, semiconductor materials, optical lenses, metal, etc. A wide range of soft to hard types are available to meet the quality requirements for stock removal.
(01)
Applications
- For first and final polishing of silicon and compound semiconductor wafers
- For polishing optical lenses and various optical glass parts
- For polishing other materials, including plastic lenses, stainless and copper plates
(02)
Characteristics
- High flatness
- Low scratch
- For the physical properties and characteristics of various products, please contact us.
(03)
Secondary processing and shipping conditions
- All POLYPAS series can be delivered with double-sided adhesive on the back of polishing pads.
- Groove processing on pad surface can be added upon request.
- POLYPAS pads can be shipped in any of the specified sizes and shapes, including round, square, and donut shapes, upon request.
Contact
Fujibo Ehime Co., Ltd.,
Tokyo Office
1-18-12, Ningyocho, Nihonbashi,
Chuo-ku, Tokyo 103-0013, Japan
TEL : +81-3-3665-7751
FAX : +81-3-3667-1326
Go to Contact Us