NEXTILE (U series)
This is a lapping pad, developed as an alternative to metal lapping plates, for the lapping of various ceramics and hard-to-machine materials such as SiC, sapphire, and GaN. Compared to metal lapping plates, NEXTILE U series offers easier maintenance and helps reduce damage to workpieces. By selecting the appropriate slurry, you can achieve lapping performance tailored to your specific needs.
(01)
Applications
- For lapping of hard-to-machine materials such as SiC, GaN, and sapphire
(02)
Characteristics
- High material removal rate
- Low surface defects
- Easier maintenance compared to metal lapping plates
(03)
Secondary processing and shipping conditions
- NEXTILE series can be supplied with double-sided adhesive on the back.
- Slurry hole processing can be added to the pad upon request.
- NEXTILE series can be supplied in any of the specified sizes and shapes, including round, square, and donut shapes, upon request.
Contact
Fujibo Ehime Co., Ltd.,
Tokyo Office
1-18-12, Nihonbashi Ningyocho,
Chuo-ku, Tokyo 103-0013, Japan
TEL : +81-3-3665-7751
FAX : +81-3-3667-1326
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